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ICP Etching System (4-inch)

Model RIE-140iP

SAMCO's RIE-140iP is a single wafer ICP etching system especially designed for compound semiconductor materials. This system features SAMCO's latest ICP plasma source technology which generates stable high-density plasma under low pressures and ensures precise anisotropic etching of GaN, InGaAs and quaternary compound semiconductor materials.

A cassette-to-cassette version of this system is also available which is equipped with a vacuum cassette chamber for high volume manufacturing. This is Model RIE-140iPC.

Applications


Fabrication of laser diodes
Etching of GaAs, InP and GaN
LD ridge formation
Waveguides
Photonic crystal devices
Quantum dot devices

Features


Single wafer processing for up to 4" round wafers
Low bias (below 100W)
Active temperature control of sample stage and inner wall of the reaction chamber
TMP for the load lock chamber
Compact footprint
Interferometric endpoint detection system (optional)
Vertical sidewalls with excellent uniformity
Operation in low gas flow and low pressure ranges